Bondjet BJ855 Large Area Wedge Bonder
PR408727 · ENERGY, DEPARTMENT OF
A SEMICONDUCTOR MACHINERY MANUFACTURING solicitation, performed in Oak Ridge, TN, with responses due 2025-09-02. AwardCast estimates what this specific solicitation will close for, before you bid.
What's being bought
Bondjet BJ855 Large Area Wedge Bonder
Comparable recent awards in SEMICONDUCTOR MACHINERY MANUFACTURING
| Winner | Award value | Offers | Date |
|---|---|---|---|
| INFICON INC | $58K | 1 | 2026-05-26 |
| VACUUM ONE INC | $52K | 36 | 2026-05-14 |
| EBARA TECHNOLOGIES INC | $45K | 18 | 2026-05-05 |
| KURT J LESKER CO | $18K | 3 | 2026-04-17 |
| PLASMABILITY LLC | $630K | 3 | 2025-09-26 |
Questions
What is solicitation PR408727?
Bondjet BJ855 Large Area Wedge Bonder, issued by ENERGY, DEPARTMENT OF, under NAICS 333242 (SEMICONDUCTOR MACHINERY MANUFACTURING), performed in Oak Ridge, TN. Responses are due 2025-09-02.
What do similar contracts close for?
Comparable closed awards in this category ran from $18K to $630K, across 5 awards shown above. Those are historical results, not a forecast for this solicitation.
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