Semiconductor Die Bonding and Vacuum Packaging System
N0017326P2436 · DEPT OF DEFENSE
A PACKAGING MACHINERY MANUFACTURING solicitation, performed in Washington, DC. AwardCast estimates what this specific solicitation will close for, before you bid.
What's being bought
This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.
Comparable recent awards in PACKAGING MACHINERY MANUFACTURING
| Winner | Award value | Offers | Date |
|---|---|---|---|
| FARASON CORPORATION | $100K | n/a | 2026-07-02 |
| PEARSON MEDICAL TECHNOLOGIES, LLC | $34K | 3 | 2026-06-29 |
| INDEPENDENT METAL STRAP CO INC | $13K | 1 | 2026-06-28 |
| INDEPENDENT METAL STRAP CO INC | $74K | n/a | 2026-06-17 |
| INDEPENDENT METAL STRAP CO INC | $13K | 1 | 2026-06-16 |
Questions
What is solicitation N0017326P2436?
Semiconductor Die Bonding and Vacuum Packaging System, issued by DEPT OF DEFENSE, under NAICS 333993 (PACKAGING MACHINERY MANUFACTURING), performed in Washington, DC.
What do similar contracts close for?
Comparable closed awards in this category ran from $13K to $100K, across 5 awards shown above. Those are historical results, not a forecast for this solicitation.
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